Ion Pad Technology

The Ion Pad features a unique dual-layer structure with a specialized resin coating on a polymer-based material. It generates intermolecular forces with the target surface during gripping. This innovative design relies solely on the material’s intrinsic coupling forces, eliminating the need for external energy sources like electricity or vacuum systems. The Ion Pad introduces a novel gripping technology that simplifies equipment by removing the need for electrical wiring and air piping. Its design is both environmentally friendly and clean, making it an ideal solution for various applications.

Key Features

• 01Ideal for Thin, Flat Materials

  The Ion Pad grips objects using its intrinsic chemical and physical properties, rather than relying on external mechanical forces. This makes it well-suited for handling thin, flat workpieces such as silicon wafers and display glass.

• 02Suitable for Use in Vacuum Environments

  The gripping mechanism is not dependent on pressure differences like vacuum suction, enabling it to function effectively even under vacuum conditions.

• 03Energy-Efficient and Space-Saving

  The Ion Pad features a gripping mechanism that leverages intermolecular interactions between its surface and the gripped object. This design eliminates the need for external energy sources like vacuum suction or electrical power.

• 04Repeatable

  The Ion Pad is designed for repeated use, as its stable special resin coating does not rely on adhesive layers. If particles adhere to the surface, the Ion Pad can be easily cleaned with pure water or industrial alcohol for continued use. However, replacement may be necessary if scratches or surface wear occur.

Main Types

Ion Pads come in two types: Adhesive Type with a smooth surface finish and Non-Adhesive Type with a textured surface finish. The Adhesive Type is ideal for gripping glass and film, while the Non-Adhesive Type is primarily used for anti-slip applications. We provide customized Ion Pad designs tailored to the specific workpiece, intended use, and operational environment.

Specification

Type		Adhesive Type	Non-Adhesive (Non-Slip) Type
Gripping surface	Material	Special resin coating
	Thickness	0.1mm or 1.0mm *Does not include backup film or base material
	Rubber Hardness	55
	Impurities	Na: 0.56ppm Al: 0.53ppm Fe: 3.2ppm Ni: 0.07ppm Zn: 0.16ppm *Test method: ICP-MS
Conditions of use	Temperature	0°C to 100°C	0°C to 150°C
	Environment	Atmosphere, vacuum, and other gas atmospheres
Gripping Force*	Type	4 φ3mm Pads	4 φ3mm Pads
	Peeling Force	MIN 100gf Peel force after 50gf for 5 sec	Appx 0gf Peel force after 50gf for 5 sec
	Slippage Force	MIN 60gf Initial force for Silicon wafer to slip (with 50gf counterweight)	MIN 60gf Initial force for Silicon wafer to slip (with 50gf counterweight)
Design

*Gripping force is a measured value under the specified conditions. It is provided as a reference and is not guaranteed.

Application Examples

Hybrid Chuck for Glass Gripping

*This product combines an electrostatic chuck with an Ion Pad.

High-speed Transport End Effector

Download Information

Various materials are available for download here:

• Gripping and Non-slip Pads (Ion Pad)