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With over 25 years of experience in designing electrostatic chucks for silicon wafers and other types of wafers, we are committed to solving your challenges. We take the time to carefully understand your goals and specifications, offering comprehensive solutions that include not only the electrostatic chucks themselves but also the related peripheral technologies to ensure optimal performance.
We also offer tailored support for everything from new product development to improving existing products, such as enhancing functionality or extending lifespan. Whether you need assistance with prototyping or mass production, feel free to reach out to us.
Q1Can the chuck be used in high-temperature environments?
Yes, it is possible, but there are limitations to the operating temperature. Please let us know your desired temperature and environment, and we will provide a tailored solution to meet your requirements.
Q2Can thin wafers be chucked and transported?
Yes, it is possible. Electrostatic chucks apply a uniform force across the entire chucking surface, enabling the safe and damage-free chucking and transport of even thin wafers.
Q3I’m having issues with managing wafer temperature and ensuring uniform thermal control. Can you help?
Yes, we can. We provide solutions customized to your desired temperature range and thermal profile, including chucks with integrated cooling structures or built-in heaters.
Q4I’m having trouble with particles on the backside of the wafer. Can you help?
Yes, we can. We provide particle-reduction solutions through various approaches, including optimizing the surface material of the electrostatic chuck, refining finishing techniques, and managing the chuck’s contact area.
Q5I want to chuck thin wafers in an atmospheric environment and transfer them directly into a vacuum process chamber.
We recommend our cordless electrostatic chuck (Electrostatic Carrier) for this purpose.
For any other general questions about electrostatic chucks, please click here.click here.