In-line Particle Cleaning on the Stage

Wafer-Type Stage Cleaner “eRaser Disk”

※Formerly known as “Cleaning Wafer” (only the product name has changed; specifications remain unchanged). In the semiconductor industry, the miniaturization and enhanced functionality of electronic devices such as PCs, tablets, and smartphones have driven the demand for smaller and higher-quality semiconductor devices. Naturally, as the circuits that determine semiconductor performance become more miniaturized, particles at the “nanometer scale”—which were previously not considered an issue—have emerged as a significant challenge in recent years.

Semiconductor manufacturing equipment represents a significant investment, and unplanned downtime not only reduces production output but also incurs substantial financial losses. Particles on the processing stage, such as pin chucks or electrostatic chucks, are common culprits behind process errors and equipment shutdowns. Typically, particle removal is performed through in-line cleaning (dummy runs) using dummy wafers. However, particles that cannot be fully removed during a dummy run require the equipment to be stopped for manual cleaning, resulting in significant downtime before operations can resume.

To address these challenges, Creative Technology developed the eRaser Disk, an innovative in-line stage cleaning tool specifically designed for semiconductor manufacturing equipment. By coating silicon wafers with a specialized resin, the eRaser Disk enhances particle removal performance, reducing dummy run durations and minimizing equipment shutdown frequencies.

eRaser Disk Introduction Video

Key Features of the eRaser Disk

１.Constructed with materials proven in vacuum processes

The eRaser Disk is made entirely from materials with a proven track record in vacuum process applications.

２.Compatible with various stages

Suitable for use on various stages, including pin chucks and electrostatic chucks used in semiconductor manufacturing equipment.

３.Reusable design

The special resin-coated surface is adhesive-free, allowing for repeated use simply by wiping off attached particles.

４.Dust capture near edges is possible.

The special elastic resin coating enables contact not only with the flat stage surface but also with its edges, effectively capturing particles.

It also captures dust adhering to the edge surface of the air hole and prevents errors caused by dust.

５.Custom-made designs available.

We offer support for standard wafers ranging from 4 to 12 inches, as well as custom-made designs. Customization to accommodate notches and orientation flats on your provided wafers is also available. Feel free to contact us through the inquiry form.