Ion Pad Technology

Our Ion Pad is a unique dual layer structure, consisting of a special resin coating on a polymer-based material. When used to grip objects, a unique chemical and physical intermolecular binding force is generated between the Ion Pad and the target object. Because it solely uses the coupling force intrinsic of the material surface, it does not require external energy supply such as electricity or vacuum when gripping the object. It is a new gripping mechanism that eliminates the need for electrical wiring and air piping and can greatly simplify equipment. It is also an environmentally friendly and clean product.

Features

• 01Ideal for Thin Flat Materials

  Since the gripping is generated by its intrinsic chemical and physical properties rather than by an external mechanical force, it is possible to grip thin and flat workpiece, such as silicon wafer and display glass.

• 02Can be Used Even in Vacuum

  Because the gripping principle does not use differential pressure such as a vacuum suction, it is possible to grip it in vacuum environments.

• 03Less Energy Consumption and Space Saving

  Ion Pad is a product with a gripping mechanism that utilizes the intermolecular interaction between the Pad surface and the surface to be gripped. It is a new gripping mechanism that does not require external energy supply, such as vacuum suctions or electrical application.

• 04Repeatable

  It can be used repeatedly because the Ion Pad retains the characteristics of a stable special resin coating unlike a cured adhesive layer. Ion Pad can be reused by washing after particle adhesion, but scratches and surface wear are subject to pad replacement.

Main types

There are two types of Ion Pad: Adhesive Type with smooth surface finish and Non-adhesive Type with rough surface finish. Adhesive Type is mainly used for gripping of glass and film, whereas Non-adhesive Type is used for anti-slip purposes. We offer customized Ion Pad designs depending on the work object, expected usage, and its use environment.

Specification

Type		Adhesive Type	Non-adhesive (non-slip) Type
Gripping surface	Material	Special resin coating
	Thickness	0.1mm or 1.0mm *Does not include backup film or base material
	Rubber Hardness	55
	Impurities	Na: 0.56ppm Al: 0.53ppm Fe: 3.2ppm Ni: 0.07ppm Zn: 0.16ppm *Test method: ICP-MS
Conditions of use	Temperature	0°C to 100°C	0°C to 150°C
	Environment	Atmosphere, vacuum and other gas atmosphere
Gripping Force*	Type	4 φ3mm Pads	4 φ3mm Pads
	Peeling Force	MIN 100gf Peel force after 50gf for 5 sec	Appx 0gf Peel force after 50gf for 5 sec
	Slippage Force	MIN 60gf Initial force for Silicon wafer to slip (with 50gf counterweight)	MIN 60gf Initial force for Silicon wafer to slip (with 50gf counterweight)
Design

*Gripping Force is solely a measurement value under above conditions. It is a reference value, and it is not a guaranteed value.

Application Examples

Hybrid Chuck for Glass Gripping

*This product is a hybrid chuck of electrostatic chuck and Ion Pad.

High-speed Transport End Effector

Download Information

Various materials can be downloaded from here.

• Gripping and non-slip pads (IonPad)